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The question though is does the stock IC location provide enough airflow to the ICs to outweigh a cubic dimension. Maybe with a FMIC that would be the case, but without modifying the present locations to provide more air, Im not sure if it is. But even then, scoops could be designed, just as they already are, which would direct air towards the other sides of the IC.The only real drawback is that cubic shapes are inherently harder to fit into our already small spaces. Later Josh
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