| At that temperature speed becomes important but you also have to maintain a feel for how the solder flows to the connections at the same time. I prefer a higher heat because I can solder a connection to a smaller target area with good solder flow before the heat has a chance to spread away from the target area. When you use a lower heat it takes longer for the solder to make a good connection and causes the heat to travel farther into the component causing potential damage to the component. The amount of heat also depends on how the particular board you're soldering accepts the heat. Glass epoxy type boards (greenish or whitish in color) hold the copper traces much better than the older phenolic board materials (brown color like the ones in our cars gauge clusters) so they can take a higher heat. The heat range I use is between 600 to 750 degrees. Until you get it down I would suggest a lower heat though. Something in the order of 500-600 degrees. Different things will also effect the heat that's needed. Like larger connections, larger circuit trace areas or a connection on a trace that's near a screw through it to hold the board to a metal chassis.
 
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